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  • Electronica Munich November 2016
    03/06/2017

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Products / Board to Board / Press Fit

Press Fit

    717 (.156) Series

    725 (.100 x .200) Series

    726 (.125 x .250) Series

    737 (.156 x .200) Series

    745 (.100 x .200) Series

    746 (.125 x .250) Series


    Description:
    • Compliant pin press fit technology with make before break hot swap capability
    • Solderless field serviceable board contacts in 0.100, 0.125 and 0.156 spacing
    • Gold-over-nickel plated contacts with nickel underlay, in PCB thru-hole or wirewrap terminations
    • Optional MBB technology allows for hot swapping circuit boards using make-before-break contacts
    • From 5 to 150 pins (0.100), 5 to 120 pins (0.125) or 5 to 86 pins (0.156)
    • Unique compliant pin design allows for low insertion force and no damage to boards
    • Also available in a press fit telecom ribbon connector style (Series B57 see Telecom Backplane Connector)