472 Series

cardEDGE+

Features

  • Low Profile for Space Saving
  • Insertion Loss: Differential Pair Signaling 19 Gbps @ -3 dB
  • Available in 100 and 150 contacts
  • Available in Vertical SMT and Right Angle SMT
  • PCIe 3.0 Compliant
  • Application: Server, Data Storage
 

Specifications

  • Housing Material: High Temperature Thermoplastic UL-94V-0
  • Contact Material: Copper Alloy
  • Soldering: Copper Alloy
  • Contact Plating: Gold Flash Plating
  • Voltage Rating: 200 V AC
  • Current Rating: 1.4 A
  • Contact Resistance: 25 m? Maximum
  • Dielectric Withstand Voltage: 200 V AC for 60 seconds
  • Insulation Resistance: 10000 M? Minimum
  • -55°C to +125°C
  • Mating Force: 0.52 N/Pin Maximum
  • Unmating Force: 0.09 N/Pin Minimum


 

Notes

Ordering Guide:

 
472
 

High Speed Card Edge Connectors | Board to Board 0.8 mm Pitch | Vertical SMT | Plug


OR

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Stocking Distributors

  • TLC Electronics Logo
  • www.onlinecomponents.com Logo
  • PUI Interconnect Distributor LOGO

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