370 Series

Features

• High Density for Space Saving
• Insertion Loss: Differential Pair Signaling 21 Gbps @ -3 dB
• Available in 20, 100, 180, and 200 contacts
• Height: 7.8 mm
• SAS 3.0 & PCIe Compliant
• Application: IPC, Server, Data Storage

Specifications

• Housing Material: High Temperature Thermoplastic UL-94V-0
• Contact & Shield Material: Copper Alloy
• Contact Plating: Gold Flash Plating
• Current Rating: 3.1 A/ Pin
• Contact Resistance: Initial: 15 m? Maximum, After Test: rR 5 m?
• Dielectric Withstand Voltage: 750 V AC for 60 seconds
• Insulation Resistance: 1000 M? Minimum
• -55°C to +125°C
• Mating Force: 0.63 N/Pair Maximum
• Unmating Force: 0.06 N/Pair Minimum

Notes